Paras Defence Managing Director Munjal Sharad Shah explains the launch of Paras Semiconductor and its strategic focus
Advanced chip packaging is beginning to take shape within India’s defence manufacturing landscape with the launch of Paras Semiconductor Pvt. Ltd., a new subsidiary of Paras Defence and Space Technologies Ltd.. The move marks the company’s entry into advanced semiconductor packaging and assembly, an area increasingly viewed as critical for defence, strategic electronics, and secure computing applications.
Paras Semiconductor has been established to focus on advanced heterogeneous and 3D semiconductor packaging, positioning itself as a domestic OSAT facility for high-reliability defence and strategic use cases. The planned facility will support packaging for semiconductor devices used in optical and optronic systems, high-performance computing, networking, and data centre applications linked to defence and security requirements.
Advanced packaging has emerged as a key link between chip fabrication and end-use systems, particularly as the semiconductor industry moves away from large monolithic chips toward chiplets and system-in-package architectures. These approaches allow multiple chips to be integrated into a single system, delivering improved performance, lower power consumption, and higher reliability. While India has developed strength in semiconductor design and policy support for fabrication, domestic capability in advanced packaging remains limited, especially for defence-grade applications.
The new subsidiary is intended to address this gap by building local capability in packaging, testing, and qualification for strategic electronics. Paras Semiconductor is envisioned as a long-term platform aligned with national priorities around defence self-reliance, secure supply chains, and trusted electronics manufacturing.
Commenting on the launch, Munjal Sharad Shah, Managing Director of Paras Defence and Space Technologies Ltd., said that semiconductors have become strategically important in the current global environment, particularly for defence and national security. He noted that advanced packaging plays a central role in ensuring performance, reliability, and supply chain control for sensitive applications, and that the new venture complements Paras Defence’s existing strengths in defence electronics.
Beyond manufacturing capability, the initiative is also expected to contribute to skill development and ecosystem creation across semiconductor packaging, testing, and allied engineering domains. As global supply chains face increasing pressure from trade restrictions and geopolitical uncertainty, domestic advanced packaging is being viewed as a strategic capability rather than a purely manufacturing function.
Globally, advanced semiconductor packaging is becoming central to applications such as high-performance computing, secure communications, radar systems, and electronic warfare. By entering this segment, Paras Defence aims to participate more deeply in India’s evolving defence electronics ecosystem while supporting long-term objectives around technology control, reliability, and assured availability.
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