Ashok Chandak, President, India Electronics and Semiconductor Association (IESA), says summit signals India’s shift from new product introduction to scalable semiconductor manufacturing
Bengaluru | 26 February 2026: The India Electronics and Semiconductor Association (IESA) concluded its Vision Summit 2026 with a series of strategic collaborations, technology unveilings and talent initiatives that underline India’s accelerating semiconductor ambitions.
Over two days, the summit brought together more than 1,500 industry leaders, policymakers, academia and deep-tech innovators, with announcements spanning chip design, advanced packaging, backend testing, AI-enabled engineering workflows, workforce development and startup acceleration.
Speaking during the MoU exchanges and partnership unveilings, Ashok Chandak, President, India Electronics and Semiconductor Association (IESA), said:
“India’s semiconductor momentum is now structured, collaborative and execution-driven. This was not incremental progress; it was ecosystem alignment in action. From backend capability expansion and post-silicon integration to AI-enabled engineering and talent creation, these initiatives collectively move India toward product ownership and scalable volume manufacturing.”
Key Strategic Developments
RISC V Technology Transfer for Sovereign Silicon
Akeana and Aritrak entered a strategic technology transfer agreement aimed at strengthening India’s fabless ecosystem through locally co-developed RISC V intellectual property under a Tech Collaboration Center model.
Strengthening Design-to-Manufacturing Integration
Kaynes Semicon partnered with Terminus Circuits to integrate post-silicon IP capabilities with ATMP and manufacturing expertise, reinforcing India’s domestic semiconductor value chain.
Backend Capability Expansion
RRP Electronics and HCL Technologies announced a collaboration combining advanced packaging formats such as QFN, DFN, BGA and LGA with test engineering and reliability qualification capabilities.
Suchi Semicon and HCL Technologies also unveiled an end-to-end semiconductor delivery model within India, deepening domestic value addition across packaging and testing ecosystems.
Talent Pipeline for Fab and OSAT Ecosystems
An Advanced Certification in IC Manufacturing and Packaging was launched through collaboration between IIT Roorkee’s iHub Divyasampark, Siemens EDA and Maven Silicon, targeting structured industry-ready talent creation.
AI-Enabled Engineering Acceleration
Emerson NI introduced Nigel, an AI-powered code completion tool designed to accelerate engineering workflows and validation cycles.
Deep-Tech Startup Enablement
NXP India announced Season 5 of its Tech Startup Challenge, reinforcing India’s semiconductor innovation pipeline.
The summit reinforced India’s transition from ecosystem development toward coordinated execution, backend expansion and scalable semiconductor manufacturing readiness.
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